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filingDate 2015-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffd7237b0d332a53a77b3225c4119319
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publicationDate 2019-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10194251-B2
titleOfInvention Top port microphone with enlarged back volume
abstract A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.
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Total number of triples: 30.