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filingDate 2017-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6eecc3de1f2b79f7c6b4038dccdd95d
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publicationDate 2019-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10177033-B2
titleOfInvention Methods for forming a semiconductor device and semiconductor devices
abstract A method for forming a semiconductor device includes forming a plurality of non-semiconductor material portions at a first side of a semiconductor substrate; forming semiconductor material on the plurality of non-semiconductor material portions to bury the plurality of non-semiconductor material portions within semiconductor material; removing at least a portion of the semiconductor substrate from a second side of the semiconductor substrate to uncover the plurality of non-semiconductor material portions at a backside of the semiconductor device; and forming a rough surface at the backside of the semiconductor device by removing at least a subset of the plurality of non-semiconductor material portions while at least a part of a semiconductor material located laterally between the plurality of non-semiconductor material portions remains or by removing at least a part of a semiconductor material located laterally between the plurality of non-semiconductor material portions while the plurality of non-semiconductor material portions remain.
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