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filingDate 2018-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10153410-B2
titleOfInvention Method for manufacturing light-emitting device
abstract A method of manufacturing a light-emitting device includes flip-chip mounting a plurality of light-emitting elements on a substrate separately from each other. A light-transmissive member is bonded on the plurality of light-emitting elements. The light-transmissive member includes a matrix and a manganese-activated fluoride fluorescent material that functions as a wavelength conversion member. A lateral surface of the light-transmissive member is exposed between at least one pair of the plurality of light-emitting elements that are adjacent with each other. A light-reflective covering member is provided on the substrate to cover the lateral surface and a top surface of the light-transmissive member. A portion of the light-reflective covering member that is located on a top surface of the light-reflective covering member is removed to expose the light-transmissive member. The substrate and the light-reflective covering member are cut to yield individual pieces of light-emitting devices.
priorityDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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