Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 |
filingDate |
2017-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bdee699d96792609bf442c596e57149 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc40e73404d702ed8f09f797d8e5f699 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_319eb2ec42f463d0d0f5e7d0c16310a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eaeced56dc0fd546792086051736aab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0531f91fda4b2fd5a50e30651b7864c4 |
publicationDate |
2018-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10147612-B2 |
titleOfInvention |
Metal pattern forming method |
abstract |
A metal pattern forming method according to an embodiment includes forming a metal film on a surface of a substrate by an electroless plating method, the substrate including a first layer including a protrusion and a recess, and a film thickness of the metal film being a half or more of a width of the recess; and performing wet etching, the metal film in the recess removed by the wet etching and the metal film on the protrusion remained after the wet etching. |
priorityDate |
2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |