patent/US-10141280-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10141280-B2

Outgoing Links

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filingDate	2015-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55f458d34199152a5f7337399f9f5b0e
publicationDate	2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-10141280-B2
titleOfInvention	Mechanisms for forming package structure
abstract	Structures and formation methods of a package structure are provided. The package structure includes a semiconductor die and a substrate bonded to the semiconductor die through a first bonding structure and a second bonding structure therebetween. The first bonding structure and the second bonding structure are next to each other and the second bonding structure is wider than the first bonding structure. The first bonding structure has a first under bump metallurgy (UBM) structure and a first solder bump thereon, and the second bonding structure has a second UBM structure and a second solder bump thereon. The second UBM structure has a maximum width larger than that of the first UBM structure, and the second solder bump has a maximum width larger than that of the first solder bump.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021082798-A1
priorityDate	2013-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83648 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777387

Total number of triples: 78.