| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c06f7b5e757007f23ade3135b77f6c25 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2001-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T16-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2003-248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-0062
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22D45-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22D45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-102 |
| filingDate |
2013-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b7b7d401266c11dbf51ef64cefb7997 |
| publicationDate |
2018-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10119054-B2 |
| titleOfInvention |
Filling material, a sealing structure and a method of making the sealing structure |
| abstract |
A liquid epoxy resin, a powdered metal and a hardening agent are provided as a filling material (S) and poured into an insert hole (82). The filling material (S) is in a liquid state under a normal temperature so as to make the filling material (S) handle easily in the filling work. The filling material (S) is hardened at a clearance between a bushing tool (12) and the insert hole (82). The filling material (S) is placed between the bushing tool (12) and the insert hole (82) to enhance a heat-conductivity therebetween. By heat treating a metallic mold die 80, it is possible to char the epoxy resin. This makes it possible to deposit the powdered metal (copper or the like) over an entire area of the clearance so as to highly enhance the heat-conductivity. |
| priorityDate |
2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |