Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66545 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0847 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-26506 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B10-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823821 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823814 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-167 |
filingDate |
2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50ec5d6304eb8d7b3fd673fc5772ae8e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39d3cd30365622b0081dee9e814a118d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fba84a51998491ecf646d5effa33e72d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b216a1fbec3e4bdacbad393880bc2188 |
publicationDate |
2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10115728-B1 |
titleOfInvention |
Laser spike annealing for solid phase epitaxy and low contact resistance in an SRAM with a shared PFET and NFET trench |
abstract |
Embodiments are directed to a method of forming a semiconductor device and resulting structures having a shared SRAM trench and a common contact having a low contact resistance. The method includes forming a first semiconductor fin opposite a surface of a substrate and forming a second semiconductor fin opposite the surface of the substrate and adjacent to the first semiconductor fin. A doped region is formed over portions of each of the first and second semiconductor fins and a dielectric layer is formed over the doped regions. A shared trench is formed in the dielectric layer exposing portions of the doped regions. The exposed doped regions are then amorphized and recrystallized. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11201159-B2 |
priorityDate |
2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |