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filingDate 2016-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_187eaa502e4d2780f24df2d238cb1df2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e08d91ff19fce642276d4cd68e163970
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publicationDate 2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10084070-B2
titleOfInvention Punch through stopper in bulk finFET device
abstract A method of forming a semiconductor device that includes forming a fin structure from a bulk semiconductor substrate and forming an isolation region contacting a lower portion of a sidewall of the fin structure, wherein an upper portion of the sidewall of the fin structure is exposed. A sacrificial spacer is formed on the upper portion of the sidewall of the fin structure. The isolation regions are recessed to provide an exposed section of the sidewall of the fin structure. A doped semiconductor material is formed on the exposed section of the lower portion of the sidewall of the fin structure. Dopant is diffused from the doped semiconductor material to a base portion of the fin structure.
priorityDate 2014-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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