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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da8e5f7279951e796b974189caeaa8a3
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publicationDate 2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10068868-B2
titleOfInvention Multi-strike process for bonding packages and the packages thereof
abstract A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
priorityDate 2015-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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