Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
filingDate |
2017-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf2bd0b39edbdaff655ed035308c5dfe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30be3e029a0ab7736089707cd5c1ad89 |
publicationDate |
2018-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10051737-B2 |
titleOfInvention |
Multilayer circuit structure |
abstract |
An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles. |
priorityDate |
2015-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |