| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f4e0f3f5a13fc8e90f36571219dfc4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_282345277cfb03a279bd05b4fcd5b7ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80998ecad6fa12a3586ec620e1268362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6707746ab6722ffc948255a240890557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44ec75934f4fdbddfa931d411a1f6033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be370813f6921765731465598646762a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5387 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0551 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-04 |
| filingDate |
2012-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3f1b6dfa6e4be1b54ec9e3089444afc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac6bf3caaf0caa0cf460b811ff3885f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5ff2f70c8dabc7ec57203e6a4e5c48b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf1963f4c618742376ba553daff5a94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6291751779cc0e13739a00fe0582d25a |
| publicationDate |
2018-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10046158-B2 |
| titleOfInvention |
Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates |
| abstract |
An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10342971-B2 |
| priorityDate |
2009-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |