| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6409e25ad5decbd043ed7439fbf842ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fae69d3424c2ff03f8b25476005a0c46 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-184 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-069 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2015-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d406f0ff3012d9d7afdefd88cf7dd452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d25113e4ae85a92bfadaf4fddb7109a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38c98c1ade20c80a98fa0eb3d86e151d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d01a19fcdcd767630acd5c1a73a238e |
| publicationDate |
2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10015882-B1 |
| titleOfInvention |
Modular semiconductor package |
| abstract |
Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D984397-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11791251-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10424536-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10534013-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10649000-B2 |
| priorityDate |
2015-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |