Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-87 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L51-529 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52 |
filingDate |
2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ae5cb4dd679cccd993e3f9dd7842a94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f73b81e024c77aa108e5e8965ecebca4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78e1362da67794a74c96d7eb33196988 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5920b1fac04c3847b01e714a05fd7b3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0c29fc90e4b990f66fda659ab0577b4 |
publicationDate |
2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10014237-B2 |
titleOfInvention |
Circuit board having a heat dissipating sheet with varying metal grain size |
abstract |
A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019371688-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10770231-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11232991-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018174754-A1 |
priorityDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |