http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-M506372-U

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6c1e4687d353de22c872924d24bab3f
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8592
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45644
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
filingDate 2014-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_932b104dc05df3c2203a10c2e0dc8fd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_409edcc78ff1f33130fdaa4bf6ccaa9e
publicationDate 2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-M506372-U
titleOfInvention Lead used in die package
abstract The present invention relates to a lead having a metal core, a dielectric layer, and a ground connectable metallization, wherein the lead has one or more vapor barrier coatings. Further, the present invention relates to a die package with at least one lead according to the invention.
priorityDate 2013-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID447138
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099167
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6335491
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099531
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6328551
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451770050

Total number of triples: 51.