abstract |
The present invention provides a siloxane resin composition which has excellent storage stability and can obtain a cured film with excellent adhesion and chemical resistance to glass substrates or metal substrates even under low temperature curing conditions below 100°C. It is a siloxane resin composition, which contains: (A) polysiloxane, (B) a sensitizer, (C) a polymerizable compound having a phosphorus atom, and (D) a silane compound having a urea group. |