http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I754756-B

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filingDate 2018-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e13ce517ec4c39dff4f7cf07d949690
publicationDate 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I754756-B
titleOfInvention Radiation sensitive resin composition and resist pattern forming method
abstract A radiation-sensitive resin composition comprising: a first polymer having a first structural unit containing a phenolic hydroxyl group and a second structural unit containing an acid dissociable group; and a second polymer having a fluorine atom and a silicon atom at least one, and has a third structural unit containing an alkali dissociable group; a first compound, which is generated by irradiation with radiation and causes the acid dissociation based on a temperature of 80°C or higher and 130°C or lower, T X °C and 1 minute An acid that dissociates under the conditions of the above-mentioned conditions; and a second compound that generates a carboxylic acid whose dissociation property of the acid does not substantially dissociate under the conditions of the temperature T x °C and 1 minute by irradiation with radiation, and causes the acid to dissociate. The acid dissociation property is based on a sulfonic acid that does not substantially dissociate under the conditions of the temperature T X °C and 1 minute, or a combination thereof.
priorityDate 2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 39.