http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I753971-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a8bad24c6088d7a1deaa523dd4cfff7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D213-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2017-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e580743b132d8ee895f8e900b16f07a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ec978468ba11ef7359241df43734d06 |
| publicationDate | 2022-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I753971-B |
| titleOfInvention | Electrolytic nickel (alloy) plating solution |
| abstract | An objective of the present invention is to provide an electrolytic nickel (alloy) plating solution which is possible to fill micro holes or micro recesses 14 in an electronic circuit component with nickel or nickel alloy 18 without occurrence of defects such as voids and seams, and which is possible to firmly join electronic components to each other by filling a small gap when joining two or more electronic components. Also, another objectives are to provide a nickel or nickel alloy plating filling method using the electrolytic nickel (alloy) plating solution, a method of manufacturing a micro three-dimensional structure, an electronic component joined-body and a method of manufacturing the same. The above objectives can be attained by filling the micro holes or the micro recesses 14 with an electrolytic nickel (alloy) plating solution containing a specific N-substituted pyridinium compound. |
| priorityDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.