| abstract |
The present invention provides a photosensitive resin composition having a high elongation at break when formed into a cured film, a polymer precursor, a cured film, a laminate, and a method for producing a cured film, and a semiconductor device, And it is excellent in storage stability. A photosensitive resin composition comprising a polymer precursor, a photo-radical polymerization initiator and a solvent selected from the group consisting of polyimide precursors and polybenzoxazole precursors, and the polymer precursors contain The pH of the neutralization point is in the range of 7.0 to 12.0, the acid value of the acid group is in the range of 2.5 to 34.0 mgKOH/g, and the polymer precursor has a radical polymerizable group, or contains a radical other than the polymer precursor. polymeric compound. |