| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02J50-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2017-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27975be997f884a14287987b7c2a110c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2821efd45795fd21b823dad2f1ac7fb4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_919b66dbe6209a169b75015a24289a23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8965641a90b0ffbc447f869f5b0b6c78 |
| publicationDate |
2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I750173-B |
| titleOfInvention |
Test board for semiconductor package, and test system |
| abstract |
A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit. |
| priorityDate |
2016-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |