| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 |
| filingDate |
2016-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26bd540c97b885c93283a2eef8590722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff9ec35fc541d73c74afd9e7642a6ac4 |
| publicationDate |
2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I750140-B |
| titleOfInvention |
Wafer protecting method |
| abstract |
A curable resin film 12 of the present application is adhered to a surface having bumps of a semiconductor wafer and is cured by heat, whereby a circuit surface of the semiconductor wafer and bases of the bumps are protected, wherein the linear expansion coefficient (α1) of a cured material of the curable resin film 12 at -50℃ to Tg -30℃ is 1×10-6 to 80×10-6/℃. A sheet for forming the first protective film 1 includes a first supporting sheet 101 and the curable resin film 12 on a surface of one side of the first supporting sheet 101. |
| priorityDate |
2015-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |