| abstract |
The subject of the present invention is to provide a curable resin composition that satisfies the required performance of both solder resist and cover film, does not impair developability, has excellent heat resistance or low rebound properties, and has less warpage after heating . Furthermore, there is provided a curable resin composition which satisfies the required performance of both a solder resist and a cover film, and is excellent in developability (alkali solubility) or heat resistance (solder heat resistance). "The means for solving the problem is a curable resin composition containing an alkali-soluble polyimide resin, an alkali-soluble resin other than the polyimide resin, and a curable compound." |