| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1d29f7ac2c7f9be9f7dae1a83bbb5c92 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2030-885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2030-128 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-4022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-0059
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N30-7206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N30-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-02 |
| filingDate |
2017-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2ea7f1e2e51b242fa2e19e688b06f4c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33d400e6b619ada6cd59a9f99406094f |
| publicationDate |
2021-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I749125-B |
| titleOfInvention |
Analysis method of surface impurities of polysilicon crushed material |
| abstract |
The aim is to provide an analysis method that can qualitatively and further quantify the adhesion resin of polycrystalline silicon fragments with high sensitivity.n n n n n After the organic volatile components are removed by heating from the broken polysilicon, the temperature of the broken polysilicon is raised under the flow of inert gas, and the resin decomposition product generated at the above heating temperature is captured, and the resin is included in the analysis by analysis The above-mentioned resin-specific decomposition product in the decomposition product is identified to identify the type of resin attached to the above-mentioned polycrystalline silicon crushed product. Furthermore, a calibration curve is prepared for each of the resin-specific decomposition products, and based on the calibration curve, the adhesion amount of each of the adhesion resins can be quantified. |
| priorityDate |
2016-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |