http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I745314-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2016-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff9ec35fc541d73c74afd9e7642a6ac4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26bd540c97b885c93283a2eef8590722 |
| publicationDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I745314-B |
| titleOfInvention | Sheet for forming protective film |
| abstract | A sheet for forming a protective film 1 of the present application is formed by laminating a heat-curable resin layer 12 on a first supporting sheet 101, the heat-curable resin layer 12 is adhered to a surface having bumps of a semiconductor wafer and is cured by heat, whereby the first protective film is formed on the semiconductor wafer surface, wherein the difference between the surface free energy of a surface of the first supporting sheet 101 side of the pre-heated heat-curable resin layer 12 and that of a surface of the heat-curable resin layer 12 side of the first supporting sheet 101 is 10mJ/m 2 or more. |
| priorityDate | 2015-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 223.