| abstract |
The present invention discloses a resin composition comprising 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound represented by formula (1), wherein, in formula (1), m and n are each independently An integer from 10 to 100; and the fluorine-containing compound includes a tetrafluoroethylene self-polymer, a perfluoroalkoxy alkane, or a combination thereof. In addition, the present invention also discloses an article made of the aforementioned resin composition, which includes a prepreg, a resin film, a laminate or a printed circuit board, and the aforementioned article can be used in dielectric constant, dielectric loss, Z-axis thermal expansion coefficient, MIT At least one of characteristics such as the number of bending cycles and tensile strength is improved. |