http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I744556-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2afaa30d5877bd844cc746db821920 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 |
| filingDate | 2018-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2921b864588ff75b6103ca8655712d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf8d51fc85a14b40ea6a77a3f238e9dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_404244597b475763a8839879f1056de4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc615e27b9615fb2524a6388a923d952 |
| publicationDate | 2021-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I744556-B |
| titleOfInvention | Shielded package |
| abstract | The present invention provides a shielding package body that has good shielding properties against electromagnetic waves of 10 MHz to 1000 MHz, and has good adhesion between the package body and the shielding layer.nThe shielding package of the present invention has: a package for mounting electronic components on a substrate and sealing the electronic components with a sealing material; and a shielding layer having a first layer and a second layer laminated on the package in order ; The first layer is composed of a conductive resin composition, the conductive resin composition contains: (A) 100 parts by mass of the binder component, which is solid at room temperature within the total amount of not more than 100 parts by mass 5-30 parts by mass of solid epoxy resin and 20-90 parts by mass of liquid epoxy resin that is liquid at room temperature; (B) 400-1800 parts by mass of metal particles; and (C) 0.3-40 parts by mass of hardener; The metal particles (B) contain at least (B1) spherical metal particles and (B2) small flake metal particles, and the content ratio of the spherical metal particles (B1) to the metal particles (B) is 20 to 80% by mass ; The second layer is composed of a conductive resin composition, the conductive resin composition contains: a binder component, including (D) a weight average molecular weight of 1,000 or more and 400,000 or less (meth)acrylic resin , And (E) monomers with glycidyl and/or (meth)acrylic groups in the molecule; (F) metal particles with an average particle size of 10~500nm; (G) an average particle size of 1~ 50μm metal particles; and (H) radical polymerization initiator; relative to 100 parts by mass of the binder component of the second layer, the total content of the metal particles (F) and the metal particles (G) is 2000 to 80,000 mass In addition, the content ratio of the metal particles (F) is 8 to 85% by mass relative to the total amount of the metal particles (F) and the metal particles (G). |
| priorityDate | 2017-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 158.