| abstract |
The present invention provides a thermal conductive polysiloxane composition which has excellent workability and high thermal conductivity due to low viscosity. n The thermal conductive polysiloxane composition of the present invention is a thermal conductive polysiloxane composition containing (A) thermal conductive filler, and (B) at least one selected from the group of alkoxysilyl-containing compounds and dimethylpolysiloxane, and (A) component comprises two or more types of thermal conductive fillers with different average particle sizes, and at least 20 mass% of vagiform aluminum nitride particles having an average particle size as 30μm or more and 150μm or less, based on all (A) components. |