| abstract |
The present disclosure relates to a polyorganosiloxane comprising the following structural formula: X-[Si(R 1 n) 2 nO]-[Si(R 2 n) 2 nO] m n-[SiR 2 nC a nH 2a+1 nO] n n-[Si(R 1 n) 2 n]-X, where a is an arbitrary integer between 6 and 18, n is an arbitrary number between 0.7 and 20, m is an arbitrary number between 10 and 1500, m/n is an arbitrary number greater than 20, R 1 nor R 2 nis a C1-C5 alkyl group, X represents one or more groups selected from among C2-C6 alkenyl, alkoxy, hydroxyl and hydrogen. The polyorganosiloxane can significantly lower the viscosity, and improve the flowability and processability, of the resulting silicone composition, compared with other polyorganosiloxanes at the same thermally conductive filler loading. Meanwhile, for thermally conductive silicone compositions with the same viscosity, the polyorganosiloxane used as the base polymer can accept a significantly higher level of the thermally conductive fillers, thereby improving their thermal conductivity. |