| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7689e9aa4e22ebbe003ff5f0db439d9a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2553-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-202 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D65-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-90 |
| filingDate |
2017-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de0499448fc3b2f370a3ffdac325581b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71ecda523951e0bbd162640e56fcd8e9 |
| publicationDate |
2021-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I738905-B |
| titleOfInvention |
Surface conductive laminated sheet and packaging container for electronic parts |
| abstract |
The subject of the present invention is to provide a surface conductive laminate sheet that can suppress crushing and deformation of the carrier tape even when the pickup nozzle contacts the carrier tape when mounting electronic parts, and has excellent strength, and to provide the surface conductive laminate sheet A molded electronic component packaging container, especially a carrier tape or a tray for conveying electronic components. The solution to this problem is a surface conductive laminate sheet, which is formed on both sides of a sheet substrate layer composed of a polystyrene resin with a conjugated diene content of 3.0 to 8.2% by mass. It is made of a surface layer composed of a polystyrene resin with an olefin content of 2.0~7.4% by mass and a conductive resin composition of a conductive filler, and has a Martens' hardness of 50~130N/mm 2. |
| priorityDate |
2016-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |