| abstract |
The present disclosure relates to protective multilayer coatings for processing chambers and processing chamber components. In one embodiment, a multilayer protective coating includes a metal nitride layer and an oxide layer disposed thereon. In one embodiment, the multilayer protective coating further includes an oxynitride interlayer and/or an oxyfluoride layer. The multilayer protective coating may be formed on a metal alloy or ceramic substrate, such as a processing chamber or a processing chamber component used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, the metal nitride layer and the oxide layer are deposited on the substrate by atomic layer deposition. |