| abstract |
A heating equalization plate comprises a release film and a heating equalization substrate. The heating equalization substrate comprises at least one insulating layer and an adhesive layer formed on the insulating layer. The adhesive layer comprises a styrene-butadiene-styrene block copolymer in about 35 to about 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in about 5 to about 65 parts by weight, a polyphenylene ether in about 3 to about 35 parts by weight, and a dendritic acrylate oligomer in about 3 to about 45 parts by weight. |