| abstract |
The present invention discloses a slurry composition for chemical mechanical polishing that can be easily stored for a long time due to a small change in pH with time under an acidic environment. The slurry composition for chemical mechanical polishing includes an abrasive, 0.000006 to 0.01% by weight of aluminum, and water. Preferably, the number of silanol groups on the surface of the abrasive and the aluminum content satisfy the conditions of the following Mathematical Formula 1.nn n n n n n n n n n Here, S is the number of silanol groups present on 1 nm 2 of the abrasive surface (unit: number/nm 2 ), and C is the aluminum content (weight %) in the slurry composition. |