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filingDate 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85fcc48df911e101479df06041d75af6
publicationDate 2021-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I735465-B
titleOfInvention Conductive particles, conductive materials, and connection structures
abstract Provided is a conductive particle that can easily prevent the insulation of conductive particles from decreasing, and can also suppress aggregation of conductive particles.nn n n The conductive particle of the present invention has a substrate particle and a metal layer covering the surface of the substrate particle. The surface of the metal layer is covered with resin and inorganic material. The resin may contain resin particles, and the inorganic material may contain inorganic particles. Since the surface of the metal layer of the conductive particles is covered with resin and inorganic materials, it is easy to prevent the insulating properties of the conductive particles from being reduced, and it is also difficult to cause aggregation of the conductive particles with each other.
priorityDate 2015-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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