| abstract |
The subject of the present invention is to provide a composition capable of forming a cured film with low dielectric properties excellent in chemical resistance, heat resistance, and analytical performance. Furthermore, a manufacturing method using the composition is provided.nn n n n n The solution of the present invention is a composition characterized by comprising alkali-soluble resin, polysiloxane, diazonaphthoquinone derivative, a compound that generates acid or alkali due to heat or light, and a solvent. The alkali-soluble resin The resin is a polymer composed of a carboxyl-containing polymerized unit and an alkoxysilyl group-containing polymerized unit. |