http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I734676-B
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-04 |
filingDate | 2015-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a36caccc978b42be2d31abbecfd8a32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8223f0e24df09e17a35029b5ddc00dae |
publicationDate | 2021-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-I734676-B |
titleOfInvention | Liquid composition and etching method using the liquid composition |
abstract | The present invention relates to a liquid composition which is used to etch a metal compound with copper or copper as the main component formed on an oxide composed of indium, gallium, zinc and oxygen; and relates to an etching method, which The feature is that the liquid composition is brought into contact with a substrate of a metal compound containing copper or copper as the main component. The liquid composition of the present invention is characterized in that it contains (A) hydrogen peroxide, (B) acid, (C) a fluoride ion supply source, and (D) is selected from the group consisting of amino tris (methylene phosphonic acid), N,N,N',N'-ethylenediamine four (methylene phosphonic acid), diethylene triamine penta (methylene phosphonic acid), bis (hexamethylene) triamine penta (methylene Phosphonic acid) and one or more compounds in the group consisting of pentaethylene hexaamine octa (methylene phosphonic acid), (E) hydrogen peroxide stabilizer, and (F) water, and the pH is 5 or less. By using the liquid composition of the present invention, damage to the oxide composed of indium, gallium, zinc and oxygen can be suppressed, and the copper or copper formed on the oxide composed of indium, gallium, zinc and oxygen can be etched as The main component of the metal compound. |
priorityDate | 2014-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.