| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13338 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0443
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136209 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 |
| filingDate |
2018-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd4ac9cd94787037b54b88d60acce248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0daf6c97c3b00bb41665a00f3108b779 |
| publicationDate |
2021-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I733001-B |
| titleOfInvention |
Method for manufacturing substrate with wiring electrode |
| abstract |
The present invention provides a method for manufacturing a wiring electrode-attached substrate that has a fine pattern, is excellent in conductivity, and is difficult to see the opaque wiring electrode. A method of manufacturing a substrate with wiring electrodes, comprising: a step of forming an opaque wiring electrode on at least one side of a transparent substrate; a step of coating a positive photosensitive composition on one side of the transparent substrate; The opaque wiring electrode serves as a mask to expose and develop the aforementioned positive photosensitive composition, and to form a functional layer at a position corresponding to the opaque wiring electrode. |
| priorityDate |
2017-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |