| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C69-602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C69-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-30 |
| filingDate |
2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06314ebdd4b462d508f14dee9ca1bb0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01a6e509bded39c0f2674f4c87eb1d70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_377711022dfc72b747a50a552adf9c71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0db0e60d0ed73a2d552bc4a6e2ceb077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30bc3ecf0d974fdabb502da596df683a |
| publicationDate |
2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I732008-B |
| titleOfInvention |
Epoxy(metha)acrylate compounds and curable composition having epoxy(metha)acrylate compounds |
| abstract |
The present invention provides an epoxy (meth)acrylate compound of a protective film material that is not prone to migration on a conductive pattern, and a curable composition containing the compound. The epoxy (meth)acrylate compound of the present invention is represented by the following general formula (1), and the content of halogen atoms of impurities is 100 mass ppm or less. In addition, this epoxy (meth)acrylate compound is mixed with at least one of monomers or oligomers containing (meth)acrylic acid groups and a photopolymerization initiator to form a conductive pattern-type protective film The hardening composition. ( At least one of R 1 to R 5 has a structure represented by the following formula (2), and the remaining R 1 to R 5 are each independently a hydrogen atom with carbon atoms of 1 to 6 selected from alkyl groups and Any one of the group of alkoxy groups. R 6 represents a hydrogen atom or a methyl group) (* represents the connection part with the carbon atom of the benzene ring connected by R 1 to R 5 in formula (1), and R 7 represents a hydrogen atom or a methyl group). |
| priorityDate |
2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |