| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B2210-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-20061 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B11-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B11-2433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-0004 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-93 |
| filingDate |
2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ab436ddfed0ca876ea3206a8f6e2972
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80c460e2b8665b09db9ed3458eaf5bf1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd483e60d4db1a59425f732872f31b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef6725e542087a8f1ea60f820052074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_034a218d824cc86e9dae8fb5d542ea7e |
| publicationDate |
2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I731197-B |
| titleOfInvention |
Metrology system, method for wafer metrology, and non-transitory computer readable medium |
| abstract |
Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller. |
| priorityDate |
2016-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |