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filingDate 2017-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee6946f45c5f540bb7b4285e8084b023
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publicationDate 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I731074-B
titleOfInvention Processes and methods for selective deposition on first surface of substrate relative to second surface of substrate
abstract Vapor deposition processes are provided in which a material nis selectively deposited on a first surface of a substrate relative to a second organic surface of the substrate. A substrate comprising a first surface is contacted with a first vapor phase hydrophobic reactant and a second vapor phase reactant such that the material is deposited selectively on the first surface relative to the second norganic surface. The second organic surface may comprise, for example, a self-assembled monolayer, a directed self-assembled layer, or a polymer. The material that is deposited may be, for example, a metal or metallic material. The material is a metal oxide, such as ZrO 2 or HfO 2 . The vapor deposition process is a cyclic chemical vapor deposition process or an atomic layer deposition process. The material is deposited on the first surface relative to the second surface with a selectivity of greater than about 50%.
priorityDate 2016-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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