| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 |
| filingDate |
2017-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e63d8344f3180bf354de012373aa4ba |
| publicationDate |
2021-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I726988-B |
| titleOfInvention |
Resin sheet with support |
| abstract |
Provided is a resin sheet with a support, a printed wiring board, and a semiconductor device that can reduce the insertion loss and can suppress the unevenness of the insertion loss.nn n n The resin sheet with a support of the present invention is provided with a support and a resin sheet provided on the support, and the resin sheet has a first resin formed of a first resin composition provided on the support side The composition layer, and the second resin composition layer formed by the second resin composition provided on the side opposite to the support side, the composition of the first resin composition and the second resin composition are different, the first The dielectric constant of the thermosetting product of the resin composition and the thermosetting product of the second resin composition is 3.6 or less, and the dielectric tangent of the thermosetting product of the first and second resin composition is 0.01 or less. The tangent difference is 0.005 or less. |
| priorityDate |
2016-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |