http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I726112-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de77b6414ab71678bdbe43429ec5e574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_006eb389103cb336fbe39fc949599366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dd7dbd02826e3eee4bc527e0f284fe9 |
| publicationDate | 2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I726112-B |
| titleOfInvention | Photosensitive resin composition and method for manufacturing semiconductor device |
| abstract | The present invention provides a photosensitive resin composition that can obtain a cured film having excellent adhesion to metal materials, particularly copper, and high coatability even in heat treatment at low temperatures.nn n n A photosensitive resin composition containing (A) an alkali-soluble resin having an organic group derived from an aliphatic diamine, (B) a photosensitizer, and (C) a liquid under the conditions of 1013 hPa and 25°C and a boiling point of 210°C The above compound is characterized in that, with respect to 100 parts by mass of (A) an alkali-soluble resin having an organic group derived from an aliphatic diamine, 0.1 to 15 parts by mass of the aforementioned (C) is contained at 1013 hPa and 25°C. Liquid and a compound with a boiling point of 210°C or higher. |
| priorityDate | 2016-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 474.