http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724157-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2017-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4dea98bab57f16cc378ba46cf8b91a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dda556a52e15f045c6170e1f31d178ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bacae0120e81fcefbf68efe6f63b6da |
| publicationDate | 2021-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I724157-B |
| titleOfInvention | Etching solution and manufacturing method of electronic substrate |
| abstract | The object of the present invention is to provide an etching solution that can selectively remove copper and/or copper alloy from a substrate having copper and/or copper alloy and nickel and/or nickel alloy.nn n n The etching solution of the present invention is an etching solution for etching the copper and/or copper alloy from a substrate having copper and/or copper alloy and nickel or nickel alloy. The etching solution contains an organic acid (A) and an oxidizing agent (B). The acid dissociation constant (pKa) of the organic acid (A) is -1.10~2.60, using nickel as the working electrode, using Ag/AgCl filled with saturated KCl solution as the reference electrode, and using the above etching solution as the electrolyte solution. 1 The corrosion potential is 0.1V or more and 0.5V or less. |
| priorityDate | 2016-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 130.