| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9047b16961c0aee78d7de367969339b2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05576
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-89 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2b83ff2aa24cafe518c4675a2626268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70f11f801465ef7faa3c555d31e5ac83 |
| publicationDate |
2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I723895-B |
| titleOfInvention |
Semiconductor device and semiconductor device manufacturing method |
| abstract |
The semiconductor device of the embodiment includes a first semiconductor member, a second semiconductor member, and a first barrier film. The first semiconductor member is provided with a first insulating film and a first wiring film buried in the first insulating film and whose surface is exposed from the first insulating film. The second semiconductor member is provided with a second insulating film and a second wiring film buried in the second insulating film and whose surface is exposed from the second insulating film. The first barrier film is formed in the area where the first wiring film and the second insulating film are in contact with each other in the bonding interface where the first semiconductor member and the second semiconductor member are bonded. A predetermined metal element interacts with the second insulating film. Compounds containing predetermined elements are formed. |
| priorityDate |
2013-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |