| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26c475bcbe0c24b485b6f37c45cd921f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2170-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-1215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2475-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate |
2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23c80aec485c1f9a5104e940586c7e3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f56ca2f4f15b1e0c7558425f20e18f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e60669887afa4eaddd60aca7a91d6586
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72e1cc519437495d2237032189d8ae55 |
| publicationDate |
2021-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I722104-B |
| titleOfInvention |
Electrical debonding of pu hot melt adhesives by use of conductive inks |
| abstract |
The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained. |
| priorityDate |
2016-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |