| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-33 |
| filingDate |
2017-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8e4d293290613adf2de19805008c274 |
| publicationDate |
2021-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I720248-B |
| titleOfInvention |
Surface treatment composition, surface treatment method using the composition, and manufacturing method of semiconductor substrate |
| abstract |
The object of the present invention is to provide a method that can sufficiently remove impurities remaining on the surface of a polishing object having at least a tungsten-containing layer, and tetraethoxysilane or silicon nitride after polishing, while suppressing the dissolution rate of tungsten.n n n The solution is a surface treatment composition comprising: a polymer compound with a sulfonic acid (salt) group; at least one compound selected from amino acids and polyols; and a dispersing medium. The surface treatment composition is used for treatment It has at least a tungsten-containing layer and the surface of the polishing object after polishing of tetraethoxysilane or silicon nitride. |
| priorityDate |
2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |