http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I718225-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2016-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_153dbdb2c7f13297fca92a61d174095a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_523e5f0c7418f04134cf08ce1d859e56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59a5c03532a0c0f3d06f9ddb862a397d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7c81e8d75e496c799ca67e5901940bf |
| publicationDate | 2021-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I718225-B |
| titleOfInvention | Polishing composition and silicon substrate polishing method |
| abstract | The present invention provides a polishing composition that can realize a polished surface with smoothness and low defectivity. The polishing composition contains a water-soluble polymer that satisfies the conditions (A) and (B).nn n n Condition (A): The concentration of silica composed of silica with an average primary particle size of 35nm, water-soluble polymer, ammonia and water is 0.48% by mass, the concentration of water-soluble polymer is 0.0125% by mass, and the pH is 10.0. In a standard solution, the ratio of the amount of water-soluble polymer adsorbed on silica contained in the first standard solution to the total amount of water-soluble polymer has an adsorption rate of more than 10%.nn n n Condition (B): The concentration of silica composed of silica with an average primary particle diameter of 35nm, water-soluble polymer, ammonia and water is 0.48% by mass, the concentration of water-soluble polymer is 0.0125% by mass, and the pH is 10.4. In the two standard solutions, the adsorption rate of the amount of water-soluble polymers adsorbed on silica contained in the second standard solution to the total amount of water-soluble polymers is less than 65%. |
| priorityDate | 2016-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.