http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I717587-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2018-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0764ed582fdfd7a17127784e5ee8e6f |
| publicationDate | 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I717587-B |
| titleOfInvention | Pressure-sensitive adhesive tape for processing semiconductor substrate and method for producing semiconductor device |
| abstract | According to the present invention, it is possible to provide a pressure-sensitive adhesive tape for processing a semiconductor substrate. The pressure-sensitive adhesive tape includes a base material and a pressure-sensitive adhesive layer laminated on one side of the base material. Further, the pressure-sensitive adhesive tape is used for temporarily attaching a semiconductor sealed connection body to the base material via the pressure-sensitive adhesive layer when obtaining a plurality of semiconductor sealed bodies by cutting the semiconductor sealed connection body in the thickness direction. The semiconductor sealed connection body includes a substrate, a plurality of semiconductor elements arranged on the substrate and a sealing portion sealing the plurality of semiconductor elements. The pressure-sensitive adhesive layer contains a release agent for lowering adhesion of the pressure-sensitive adhesive layer to the sealing portion when peeling off the semiconductor sealed body from the pressure-sensitive adhesive tape. In addition, the sealing portion is composed of a sealing material containing an epoxy group-containing compound. The epoxy group-containing compound has a double bond in its molecular structure, and the release agent is a silicone-based oil or a fluorine-based surfactant. |
| priorityDate | 2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 239.