| abstract |
The present invention provides a resin sheet with a support, a method for manufacturing a printed wiring board, a printed wiring board, and a semiconductor device that can suppress the occurrence of boring portions generated in the interface extension direction of each cured resin composition layer.nn n n A resin sheet with a support body, which is a resin sheet with a support body provided with a support body and a resin sheet provided on the support body, the resin sheet having a first resin sheet formed of a first resin composition provided on the support body side The resin composition layer, and the second resin composition layer formed of the second resin composition provided on the side opposite to the support side, the first resin composition contains (a) inorganic filler, and the content of (a) component 30% by mass or less, the second resin composition contains (a) inorganic filler, the content of (a) component is 60% by mass or more, the difference between the thermal conductivity of the first thermoset and the thermal conductivity of the second thermoset Below 0.4W/mK. |