| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2441
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-2447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-71 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N23-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-711
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate |
2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cbb7c38bc4b7ed0d3079f0b8745caaf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8686e1bec8dcf660cbd0bc20fb99e6e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8ae9470d13178c67f074d6c0426a75a |
| publicationDate |
2021-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I715800-B |
| titleOfInvention |
Apparatus for high-speed imaging sensor data transfer |
| abstract |
An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect. |
| priorityDate |
2016-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |