| abstract |
The subject of the present invention is to provide a unified sealing compound for wafers, especially for large-diameter, thin-film wafers, which has good sealing properties, and provides low warpage and good wafer protection performance after sealing. Reliability and heat resistance, can perform the sealing step well, and can be suitable for use in the resin composition of wafer level packaging.nn n n n n The solution of the present invention is a resin composition characterized by containing (A) silicone resin with a weight average molecular weight of 3,000 to 500,000 with the structural unit represented by the following composition formula (1), and (B) epoxy resin curing The agent and (C) filler contain 50 to 95% by mass of the aforementioned (C) component relative to the total mass. |