http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I714672-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5a9791add84989ee56e2233bb12e7bc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1469 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01T1-24 |
| filingDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ca45937993576dddb3dc0cc35037125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c9563313916ef34a0c5f4513f3a56f1 |
| publicationDate | 2021-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I714672-B |
| titleOfInvention | Packaging methods of semiconductor x-ray detectors |
| abstract | Disclosed herein is a method for making a device suitable for detecting X-rays, the method comprising: bonding a plurality of wafers to a substrate; wherein the substrate includes an X-ray absorbing layer, which includes a first plurality of electrical contacts; Each of the two wafers includes an electronic layer, which includes a second plurality of electrical contacts and an electronic system configured to process or interpret signals generated by X-ray photons incident on the X-ray absorbing layer; make the first plurality of electrical contacts Points aligned with the second plurality of electrical contacts; mounting the wafer to the substrate such that the first plurality of electrical contacts are electrically connected to the second plurality of electrical contacts; wherein the second plurality of electrical contacts is configured to feed signals to electronic system. |
| priorityDate | 2015-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.